In conjunction with low-viscosity photoresists (e.g. Shipley 1813, AZ 4999, AZ 9260, SU8 etc.) that are particularly suited for spray coating, the process-optimised spray nozzle generates extremely fine droplets. Spray coating takes place by means of a loop-shaped spray pattern in a closed process chamber, thus ensuring uniform coating across the entire substrate surface and a high level of repeatability. Both round and square substrates, up to 4 wafers at a time, can be coated.
The iSPRAY-300 spray coater is designed for wafers with a maximum diameter of 300mm or for 12×12 inch substrates.