Plasma-Therm has pioneered dry etching for the highly specialized photomask market for more than 15 years. Mask Etcher® systems set dry etch performance and flexibility standards for photomask production. Plasma-Therm’s Mask Etcher® solution is a key enabler of Moore’s law and shrinking technology nodes. A wide variety of films can be etched from entry level 250um technology to < 32nm production with ICP high density plasma etch systems. Excellent uniformity and particle control are achieved through innovative technologies while maintaining high system production uptime. Plasma-Therm’s latest Generation V Mask Etcher excels in CD uniformity and linearity well below 5 nm.

Mask Etcher 2-V Evolution

Mask Etcher® Gen 2 Gen 3 Gen 4 GenV
Node (nm) 180 130-90 65-45 32-22


  • Dedicated platform specifically built for the highly specialized photomask market
  • Several front-end handling options: - Ballroom/Bulkhead mounting - Automated load station (ALS) - SMIF on Automated Frond End (AFE)


Integrated multifunctional endpoint capability with EndpointWorks
  • Laser Interferometry
  • OES
  • System Parameters
  • Custom input (e.g. RGA)


  • User friendly SEMI standard interface
  • Comprehensive data logging
  • Real-time process data display
  • Fully integrated endpoint system
  • Factory automation compatible (SECS/GEM)
  • Multiple user access levels
  • Alarm history


    • Compensation for uniformity and loading effect
    • Low etch bias
    • Good feature fidelity
    • Low particle and defect
    • Low line edge roughness
    • Maximized productivity and low cost of ownership