The NEO series is one of the latest addition to the industry leading NEO range of advanced plasma ashing and etching products from Trymax Semiconductor equipment. It is ready for high volume of production and can be configured with any of the current available Trymax NEO process modules, from 100 to 300mm wafer sizes. Small footprint and modular design can be configured based on Trymax products line.


Specifications summary

  • One to four process chambers
  • From 100 to 300mm wafers size
  • Mechanical throughput from 100 to 300WPH (model dependent)
  • Compact footprint

Atmospheric transfer module (EFEM)

  • One to four SMIF load-ports
  • Dual arm robot handling

Process characteristics

  • High strip rate
  • Multiple technolgoies from microwave (2.45GHz), RF (13.56MHz) ) to Direct Coupling Plasma (DCP)
  • Front end and Back end applications